ALEXANDRIA, Va., April 9 -- United States Patent no. 12,273,610, issued on April 8, was assigned to SAMSUNG DISPLAY Co. LTD. (Gyeonggi-Do, South Korea). "Display device and head mounted display devic... Read More
ALEXANDRIA, Va., April 9 -- United States Patent no. 12,273,436, issued on April 8, was assigned to THALES DIS FRANCE SAS (Meudon, France). "Method for testing if a data element belongs to a list of ... Read More
ALEXANDRIA, Va., April 9 -- United States Patent no. 12,271,234, issued on April 8, was assigned to Lenovo (Singapore) Pte. Ltd. (Singapore). "Computing device" was invented by Mark Christopher Heide... Read More
ALEXANDRIA, Va., April 9 -- United States Patent no. 12,273,164, issued on April 8, was assigned to QUALCOMM Inc. (San Diego). "Co-phasing factor indication in downlink control information" was inven... Read More
ALEXANDRIA, Va., April 9 -- United States Patent no. 12,271,402, issued on April 8, was assigned to Oracle International Corp. (Redwood Shores, Canada). "Method, product, and system to provide a pars... Read More
ALEXANDRIA, Va., April 9 -- United States Patent no. 12,269,702, issued on April 8, was assigned to TOSHIBA TEC K.K. (Tokyo). "Sheet processing device" was invented by Mikio Yamamoto (Mishima Shizuok... Read More
ALEXANDRIA, Va., April 9 -- United States Patent no. 12,269,896, issued on April 8, was assigned to PFIZER INC. (New York). "Antibodies specific for GUCY2c and uses thereof" was invented by Chew Shun... Read More
ALEXANDRIA, Va., April 9 -- United States Patent no. D1,070,205, issued on April 8, was assigned to Guangdong Souncrise Technology Co. Ltd. (Zhuhai, China). "Ultrasonic cleaning machine" was invented... Read More
ALEXANDRIA, Va., April 9 -- United States Patent no. 12,270,448, issued on April 8, was assigned to Neapco Intellectual Property Holdings LLC (Farmington Hills, Mich.). "Propeller shaft damper with r... Read More
ALEXANDRIA, Va., April 9 -- United States Patent no. 12,272,631, issued on April 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor package having multip... Read More