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US Patent Issued to SAMSUNG ELECTRONICS on June 30 for "Method of fabricating semiconductor package and semiconductor package structure including the semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,579, issued on June 30, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Method of fabricating semiconductor package ... Read More


US Patent Issued to SK hynix on June 30 for "Method of manufacturing semiconductor package using double adhesive layers" (South Korean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,580, issued on June 30, was assigned to SK hynix Inc. (Icheon-si, South Korea). "Method of manufacturing semiconductor package using double... Read More


US Patent Issued to Littelfuse Semiconductor (Wuxi) on June 30 for "Mesa device with stack thin film passivation" (Chinese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,581, issued on June 30, was assigned to Littelfuse Semiconductor (Wuxi) Co. Ltd. (Wuxi, China). "Mesa device with stack thin film passivati... Read More


US Patent Issued to Gwangju Institute of Science and Technology on June 30 for "Stretchable electronic device and method for fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,582, issued on June 30, was assigned to Gwangju Institute of Science and Technology (Gwangju, South Korea). "Stretchable electronic device ... Read More


US Patent Issued to UNITED MICROELECTRONICS on June 30 for "Light emitting diode structure including front side electrodes connected to metal interconnects and method of manufacturing the same" (Singaporean Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,583, issued on June 30, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu City, Taiwan). "Light emitting diode structure including fr... Read More


US Patent Issued to Amkor Technology Singapore Holding on June 30 for "Semiconductor devices and methods of manufacturing semiconductor devices" (South Korean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,584, issued on June 30, was assigned to Amkor Technology Singapore Holding Pte. Ltd. (Singapore). "Semiconductor devices and methods of man... Read More


US Patent Issued to QUALCOMM on June 30 for "Package comprising an integrated device, a chiplet and a metallization portion" (California Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,585, issued on June 30, was assigned to QUALCOMM Inc. (San Diego). "Package comprising an integrated device, a chiplet and a metallization ... Read More


US Patent Issued to Micron Technology on June 30 for "Microelectronic device packages including wirebonding and related methods, memory devices, and electronic systems" (Indian Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,586, issued on June 30, was assigned to Micron Technology Inc. (Boise, Idaho). "Microelectronic device packages including wirebonding and r... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on June 30 for "Method for forming conductive bumps by performing a reflow process" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,587, issued on June 30, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Method for forming conductive bumps... Read More


US Patent Issued to Canon on June 30 for "Semiconductor device and equipment" (Japanese Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,588, issued on June 30, was assigned to Canon K.K. (Tokyo). "Semiconductor device and equipment" was invented by Hiroaki Kobayashi (Kanagaw... Read More