US Patent Issued to HANSAE MOBILITY on Aug. 11 for "Device for assembling boot and sealing ring of constant velocity joint of vehicle" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,703,052, issued on Aug. 11, was assigned to HANSAE MOBILITY Co. LTD. (Daegu, South Korea). "Device for assembling boot and sealing ring of cons... Read More

US Patent Issued to Milwaukee Electric Tool on Aug. 11 for "Integrated dust extractor and power tool" (Wisconsin, Texas Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,703,053, issued on Aug. 11, was assigned to Milwaukee Electric Tool Corp. (Brookfield, Wis.). "Integrated dust extractor and power tool" was in... Read More

US Patent Issued to DMG MORI on Aug. 11 for "Coolant treatment apparatus" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,703,054, issued on Aug. 11, was assigned to DMG MORI Co. LTD. (Nara, Japan). "Coolant treatment apparatus" was invented by Genki Funakoshi (Nar... Read More

US Patent Issued to INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE on Aug. 11 for "Method for evaluating tool health with the temperature rising signal" (Taiwanese Inventor)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,703,055, issued on Aug. 11, was assigned to INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (Hsinchu, Taiwan). "Method for evaluating tool health with... Read More

US Patent Issued to VERTICAL CONCRETE POLISHING on Aug. 11 for "Method and apparatus for applying a uniform texture to an aggregate surface" (Georgia Inventor)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,703,056, issued on Aug. 11, was assigned to VERTICAL CONCRETE POLISHING INC. (Whitesburg, Ga.). "Method and apparatus for applying a uniform te... Read More

US Patent Issued to Applied Materials on Aug. 11 for "Method for detection of wafer slippage" (Taiwanese, American Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,703,057, issued on Aug. 11, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Method for detection of wafer slippage" was invented... Read More

US Patent Issued to EBARA on Aug. 11 for "Surface property measuring system, surface property measuring method, polishing apparatus, and polishing method" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,703,058, issued on Aug. 11, was assigned to EBARA Corp. (Tokyo). "Surface property measuring system, surface property measuring method, polishi... Read More

US Patent Issued to SHIN-ETSU HANDOTAI on Aug. 11 for "Polishing pad, double-side polishing device, and double-side polishing method for wafer" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,703,059, issued on Aug. 11, was assigned to SHIN-ETSU HANDOTAI Co. LTD. (Tokyo). "Polishing pad, double-side polishing device, and double-side ... Read More

US Patent Issued on Aug. 11 for "Environment-friendly polishing disc and processing technology thereof" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,703,060, issued on Aug. 11. "Environment-friendly polishing disc and processing technology thereof" was invented by Iuen-Chun Kim (Jinhua, Chin... Read More

US Patent Issued to EBARA, Kyushu Institute of Technology on Aug. 11 for "Polishing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,703,061, issued on Aug. 11, was assigned to EBARA Corp. (Tokyo) and Kyushu Institute of Technology (Fukuoka, Japan). "Polishing apparatus" was ... Read More

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