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Odisha businessman abducted, tortured, murdered by niece, accomplices: Police

India, April 23 -- A week after a 47-year-old businessman from Ganjam district was reported missing, police on Thursday said his 23-year-old niece conspired with her boyfriend and hired contract kille... Read More


Benefit secured by fraud voidable, generates no enforceable equities: Orissa HC

India, April 22 -- A benefit secured by fraud is voidable and generates no enforceable equities, the Orissa high court has ruled, upholding public sector undertaking Bharat Petroleum Corporation Limit... Read More


India sets ball rolling on first advanced 3d chip packaging unit

Bhubaneswar, April 22 -- The foundation stone for India's first advanced 3D chip packaging unit was laid in Odisha's Bhubaneswar on Sunday. The facility, being set up by a US-based firm at a cost of R... Read More


India launches first advanced 3D glass chip unit in Odisha

India, April 20 -- India moved a step closer to ending its dependence on imported chip packaging technology on Sunday, with Odisha Chief Minister Mohan Majhi laying the foundation stone for the countr... Read More


India's first advanced 3D glass chip unit launched in Odisha

Bhubaneswar, April 20 -- India moved a step closer to ending its dependence on imported chip packaging technology on Sunday, with Odisha chief minister Mohan Majhi and Union electronics and IT ministe... Read More


India sets ball rolling on first advanced 3d chip packaging unit

Bhubaneswar, April 20 -- The foundation stone for India's first advanced 3D chip packaging unit was laid in Odisha's Bhubaneswar on Sunday. The facility, being set up by a US-based firm at a cost of R... Read More


India's first advanced 3D glass chip unit launched in Odisha

Bhubaneswar, April 20 -- India moved a step closer to ending its dependence on imported chip packaging technology on Sunday, with Odisha chief minister Mohan Majhi and Union electronics and IT ministe... Read More


India's first advanced 3D glass chip unit launched in Odisha

Bhubaneswar, April 20 -- India moved a step closer to ending its dependence on imported chip packaging technology on Sunday, with Odisha chief minister Mohan Majhi and Union electronics and IT ministe... Read More


India sets ball rolling on first advanced 3d chip packaging unit

Bhubaneswar, April 20 -- The foundation stone for India's first advanced 3D chip packaging unit was laid in Odisha's Bhubaneswar on Sunday. The facility, being set up by a US-based firm at a cost of R... Read More


India sets ball rolling on first advanced 3d chip packaging unit

Bhubaneswar, April 20 -- The foundation stone for India's first advanced 3D chip packaging unit was laid in Odisha's Bhubaneswar on Sunday. The facility, being set up by a US-based firm at a cost of R... Read More