India, May 8 -- What Is Chemical Mechanical Polishing?

Chemical mechanical polishing (CMP) or chemical mechanical planarization (CMP), is a technique used to smoothen and flatten surfaces at the nanoscale level. It is particularly important in manufacturing integrated circuits, where microscopic features have to be precisely formed on a perfectly flat surface.

CMP offers several advantages over other techniques:

Planarization: It can achieve a very high degree of flatness, which is crucial for subsequent processing steps in chip manufacturing.

Selective Removal: The chemical component allows for the targeted removal of specific materials, leaving desired features behind.

Minimal Damage: Compared to purely mechanical polishing, CMP mi...